Robust design of microelectronics assemblies against mechanical shock, temperature and moisture

• Main Authors: Wong, E. -H. (Author), Mai, Y. W., 1946- (Author)
• Format: eBook
• Language: English
• Published: Cambridge, UK : Woodhead Publishing, [2015]
• Series: Woodhead Publishing series in electronic and optical materials ; no. 81.
• Subjects: Computer engineering.; Microelectronics > Design.; elektronické knihy; electronic books
• ISBN: 9780857099112; 0857099116; 1845695283; 9781845695286
• Physical Description: 1 online resource
• ISSN: 2050-1501
• Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty

This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. Detailed chapters cover: temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. --