Robust design of microelectronics assemblies against mechanical shock, temperature and moisture
This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...
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| Main Authors | , |
|---|---|
| Format | Electronic eBook |
| Language | English |
| Published |
Cambridge, UK :
Woodhead Publishing,
[2015]
|
| Series | Woodhead Publishing series in electronic and optical materials ;
no. 81. |
| Subjects | |
| Online Access | Full text |
| ISBN | 9780857099112 0857099116 1845695283 9781845695286 |
| ISSN | 2050-1501 |
| Physical Description | 1 online resource |
Cover
| Summary: | This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. Detailed chapters cover: temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. -- |
|---|---|
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9780857099112 0857099116 1845695283 9781845695286 |
| ISSN: | 2050-1501 |
| Access: | Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty |
| Physical Description: | 1 online resource |