rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: ISTFA 2014
    sub title: conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA
  name:
    name part: International Symposium for Testing and Failure Analysis 2014 : Houston, Tex.)
    role:
      role term: creator
  name:
    name part: Electronic Device Failure Analysis Society
    role:
      role term: organizer.
  name:
    name part: ASM International
    role:
      role term: organizer.
  type of resource: text
  genre: conference publication
  genre: elektronické knihy
  genre: electronic books
  origin info:
    place:
      place term: ohu
    date issued: 2014
    copyright date: 2014
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (560 pages) : color illustrations, photographs
  table of contents: Title Page -- TitlePage_2014 -- COPYRight Page -- EDFAS 2014 Board of Directors -- Organizing Committee-2014 -- Technical Program Committee -- 2014 -- Contents_2014 -- ISTFA2014_Combined -- cp2014istfa001 -- cp2014istfa005 -- cp2014istfa006 -- cp2014istfa012 -- cp2014istfa023 -- cp2014istfa028 -- cp2014istfa033 -- cp2014istfa038 -- cp2014istfa043 -- cp2014istfa049 -- cp2014istfa055 -- cp2014istfa065 -- cp2014istfa073 -- cp2014istfa082 -- cp2014istfa087 -- cp2014istfa094 -- cp2014istfa100 -- cp2014istfa105 -- cp2014istfa110
  table of contents: Cp2014istfa115cp2014istfa125 -- cp2014istfa130 -- cp2014istfa136 -- cp2014istfa143 -- cp2014istfa148 -- cp2014istfa152 -- cp2014istfa156 -- cp2014istfa166 -- cp2014istfa172 -- cp2014istfa178 -- cp2014istfa184 -- Combined_189-536 -- Analysis of InGaAs Epi Defects by Conductive AFM -- Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique -- Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage â€? Its Model and Cause -- Feature Based Non-Destructive Fault Isolation in Advanced IC Packages
  table of contents: Understanding the Cu Void Formation by TEM Failure AnalysismicroPREPTM -- A New Laser Tool for High-Throughput Sample Preparation -- Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit -- New Ion Source for High Precision FIB Nanomachining and Circuit Edit -- Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer -- Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips
  table of contents: Methods to Reconstruct SEM and Optical Probe Tips using a FIB ToolNear-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits -- Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation -- Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications -- Marginal Failure Diagnosed with LADA: Case Studies. -- Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging -- TDR Analysis On Short Transmission Lines
  table of contents: Productive Polishing TEM Sample Preparation Methodology DevelopmentOptimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images -- Delayering on Advanced Process Technologies using FIB -- Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System -- Debugging Phase-Locked Loop Failures in Integrated Circuit Products -- A Novel Method for the Specified Site Planar View TEM Sample Preparation -- Investigation of Protection Layer Materials for Ex-situ â€?lift-outâ€? TEM Sample Preparation with FIB for 14nm FinFET
  note: organized by Electronic Device Failure Analysis Society, ASM International.
  note: Includes index.
  note: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
  subject:
    topic: Electronics
    topic: Materials
    topic: Testing
    genre: Congresses
  subject:
    topic: Electronic apparatus and appliances
    topic: Testing
    genre: Congresses
  related item:
    title info:
      title: ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA
    name:
      name part: International Symposium for Testing and Failure Analysis (40th : 2014 : Houston, Tex.).
    origin info:
      publisher: Materials Park, Ohio : ASM International, ©2014
    physical description:
      extent: xx, 540 pages
  identifier: 9781627080750
  identifier: 1627080759
  identifier: 9781680155143
  identifier: 1680155148
  identifier: 1627080740
  identifier: 9781627080743
  identifier: https://proxy.k.utb.cz/login
  access condition: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
  record info:
    record content source: E7B
    record creation date: 150109
    record change date: 20240717213016.0
    record identifier: kn-ocn900889018
    language of cataloging:
      language term: eng