http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA
International Symposium for Testing and Failure Analysis 2014 : Houston, Tex.)
Electronic Device Failure Analysis Society
1 online resource (560 pages) : color illustrations, photographs
Title Page -- TitlePage_2014 -- COPYRight Page -- EDFAS 2014 Board of Directors -- Organizing Committee-2014 -- Technical Program Committee -- 2014 -- Contents_2014 -- ISTFA2014_Combined -- cp2014istfa001 -- cp2014istfa005 -- cp2014istfa006 -- cp2014istfa012 -- cp2014istfa023 -- cp2014istfa028 -- cp2014istfa033 -- cp2014istfa038 -- cp2014istfa043 -- cp2014istfa049 -- cp2014istfa055 -- cp2014istfa065 -- cp2014istfa073 -- cp2014istfa082 -- cp2014istfa087 -- cp2014istfa094 -- cp2014istfa100 -- cp2014istfa105 -- cp2014istfa110
Cp2014istfa115cp2014istfa125 -- cp2014istfa130 -- cp2014istfa136 -- cp2014istfa143 -- cp2014istfa148 -- cp2014istfa152 -- cp2014istfa156 -- cp2014istfa166 -- cp2014istfa172 -- cp2014istfa178 -- cp2014istfa184 -- Combined_189-536 -- Analysis of InGaAs Epi Defects by Conductive AFM -- Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique -- Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage â€? Its Model and Cause -- Feature Based Non-Destructive Fault Isolation in Advanced IC Packages
Understanding the Cu Void Formation by TEM Failure AnalysismicroPREPTM -- A New Laser Tool for High-Throughput Sample Preparation -- Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit -- New Ion Source for High Precision FIB Nanomachining and Circuit Edit -- Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer -- Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips
Methods to Reconstruct SEM and Optical Probe Tips using a FIB ToolNear-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits -- Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation -- Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications -- Marginal Failure Diagnosed with LADA: Case Studies. -- Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging -- TDR Analysis On Short Transmission Lines
Productive Polishing TEM Sample Preparation Methodology DevelopmentOptimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images -- Delayering on Advanced Process Technologies using FIB -- Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System -- Debugging Phase-Locked Loop Failures in Integrated Circuit Products -- A Novel Method for the Specified Site Planar View TEM Sample Preparation -- Investigation of Protection Layer Materials for Ex-situ â€?lift-outâ€? TEM Sample Preparation with FIB for 14nm FinFET
organized by Electronic Device Failure Analysis Society, ASM International.
Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA
International Symposium for Testing and Failure Analysis (40th : 2014 : Houston, Tex.).
Materials Park, Ohio : ASM International, ©2014