ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA
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| Corporate Author: | |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
Materials Park, Ohio :
ASM International,
2014.
|
| Subjects: | |
| ISBN: | 9781627080750 1627080759 9781680155143 1680155148 1627080740 9781627080743 |
| Physical Description: | 1 online resource (560 pages) : color illustrations, photographs |
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Table of contents
| LEADER | 05539cam a2200493 i 4500 | ||
|---|---|---|---|
| 001 | kn-ocn900889018 | ||
| 003 | OCoLC | ||
| 005 | 20240717213016.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 150109t20142014ohuao o 101 0 eng d | ||
| 040 | |a E7B |b eng |e rda |e pn |c E7B |d OCLCO |d YDXCP |d KNOVL |d OCLCO |d OCLCF |d OCLCO |d ZCU |d EBLCP |d OCLCO |d COO |d OCLCQ |d CNNOR |d UAB |d MOR |d CCO |d MERUC |d OCLCQ |d U3W |d STF |d CEF |d NRAMU |d CRU |d RRP |d ICG |d VTS |d OCLCQ |d INT |d VT2 |d OCLCQ |d WYU |d G3B |d TKN |d OCLCQ |d DKC |d OCLCQ |d VLY |d OCLCO |d OCLCQ |d UPM |d OCLCQ |d OCLCO | ||
| 020 | |a 9781627080750 |q (electronic bk.) | ||
| 020 | |a 1627080759 |q (electronic bk.) | ||
| 020 | |a 9781680155143 |q (electronic bk.) | ||
| 020 | |a 1680155148 |q (electronic bk.) | ||
| 020 | |a 1627080740 | ||
| 020 | |a 9781627080743 | ||
| 020 | |z 9781627080743 | ||
| 035 | |a (OCoLC)900889018 |z (OCoLC)923571138 |z (OCoLC)929147993 |z (OCoLC)961579108 |z (OCoLC)962700715 |z (OCoLC)1162278890 | ||
| 111 | 2 | |a International Symposium for Testing and Failure Analysis |n (40th : |d 2014 : |c Houston, Tex.) | |
| 245 | 1 | 0 | |a ISTFA 2014 : |b conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA / |c organized by Electronic Device Failure Analysis Society, ASM International. |
| 264 | 1 | |a Materials Park, Ohio : |b ASM International, |c 2014. | |
| 264 | 4 | |c ©2014 | |
| 300 | |a 1 online resource (560 pages) : |b color illustrations, photographs | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 500 | |a Includes index. | ||
| 505 | 0 | |a Title Page -- TitlePage_2014 -- COPYRight Page -- EDFAS 2014 Board of Directors -- Organizing Committee-2014 -- Technical Program Committee -- 2014 -- Contents_2014 -- ISTFA2014_Combined -- cp2014istfa001 -- cp2014istfa005 -- cp2014istfa006 -- cp2014istfa012 -- cp2014istfa023 -- cp2014istfa028 -- cp2014istfa033 -- cp2014istfa038 -- cp2014istfa043 -- cp2014istfa049 -- cp2014istfa055 -- cp2014istfa065 -- cp2014istfa073 -- cp2014istfa082 -- cp2014istfa087 -- cp2014istfa094 -- cp2014istfa100 -- cp2014istfa105 -- cp2014istfa110 | |
| 505 | 8 | |a Cp2014istfa115cp2014istfa125 -- cp2014istfa130 -- cp2014istfa136 -- cp2014istfa143 -- cp2014istfa148 -- cp2014istfa152 -- cp2014istfa156 -- cp2014istfa166 -- cp2014istfa172 -- cp2014istfa178 -- cp2014istfa184 -- Combined_189-536 -- Analysis of InGaAs Epi Defects by Conductive AFM -- Failure analysis of bit line to SNC leakage fail in 2xnm DRAM using Nano- Probing technique -- Analysis of an Anomalous CMOS Transistor Exhibiting Drain to Source Leakage � Its Model and Cause -- Feature Based Non-Destructive Fault Isolation in Advanced IC Packages | |
| 505 | 8 | |a Understanding the Cu Void Formation by TEM Failure AnalysismicroPREPTM -- A New Laser Tool for High-Throughput Sample Preparation -- Using Energy Dispersive Spectroscopy (EDS) to Determine the Resistance of FIB Jumpers for Circuit Edit -- New Ion Source for High Precision FIB Nanomachining and Circuit Edit -- Evaluation of Power SiC-MOSFET Using Super-Higher-Order Scanning Nonlinear Dielectric Microscopy: Imaging of Carrier Distribution and Depletion Layer -- Imaging Performance of aSIL Microscopy on Subsurface Imaging of SOI Chips | |
| 505 | 8 | |a Methods to Reconstruct SEM and Optical Probe Tips using a FIB ToolNear-Field Scanning Optical Microscopy for Through-Silicon Imaging and Fault Isolation of Integrated Circuits -- Characterization and simulation of a body biased structure in triple-well technology under pulsed photoelectric laser stimulation -- Continuous-wave 1064nm laser for Laser Voltage Imaging and Probing Applications -- Marginal Failure Diagnosed with LADA: Case Studies. -- Sample Preparation for High Numerical Aperture Solid Immersion Lens Laser Imaging -- TDR Analysis On Short Transmission Lines | |
| 505 | 8 | |a Productive Polishing TEM Sample Preparation Methodology DevelopmentOptimization of TEM Sample Preparation to Reduce the Overlapping of TEM Images -- Delayering on Advanced Process Technologies using FIB -- Failure Analysis Enhancement by Incorporating a Compact Scan Diagnosis System -- Debugging Phase-Locked Loop Failures in Integrated Circuit Products -- A Novel Method for the Specified Site Planar View TEM Sample Preparation -- Investigation of Protection Layer Materials for Ex-situ �lift-out� TEM Sample Preparation with FIB for 14nm FinFET | |
| 506 | |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty | ||
| 590 | |a Knovel |b Knovel (All titles) | ||
| 650 | 0 | |a Electronics |x Materials |x Testing |v Congresses. | |
| 650 | 0 | |a Electronic apparatus and appliances |x Testing |v Congresses. | |
| 655 | 7 | |a elektronické knihy |7 fd186907 |2 czenas | |
| 655 | 9 | |a electronic books |2 eczenas | |
| 710 | 2 | |a Electronic Device Failure Analysis Society, |e organizer. | |
| 710 | 2 | |a ASM International, |e organizer. | |
| 776 | 0 | 8 | |i Print version: |a International Symposium for Testing and Failure Analysis (40th : 2014 : Houston, Tex.). |t ISTFA 2014 : conference proceedings from the 40th International Symposium for Testing and Failure Analysis ; November 9-13, 2014, George R. Brown Conversion Center, Houston, Texas, USA. |d Materials Park, Ohio : ASM International, ©2014 |h xx, 540 pages |z 9781627080743 |
| 856 | 4 | 0 | |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpISTFAC31/istfa-2014-conference?kpromoter=marc |y Full text |
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