Lead-free solders
"Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover: Factors affecting the wetting behavior of solders and evolution of interfacial microstructure ; Pb-free hi...
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| Corporate Author: | |
|---|---|
| Other Authors: | |
| Format: | eBook |
| Language: | English |
| Published: |
West Conshohocken, PA :
ASTM International,
©2011.
|
| Series: | Journal of ASTM International. Selected technical papers ;
STP 1530. |
| Subjects: | |
| ISBN: | 9781621987383 1621987388 9780803175167 0803175167 |
| Physical Description: | 1 online resource (viii, 203 pages) : illustrations |
Cover
Table of contents
| LEADER | 04808cam a2200445 a 4500 | ||
|---|---|---|---|
| 001 | kn-ocn853660052 | ||
| 003 | OCoLC | ||
| 005 | 20240717213016.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 130725s2011 paua ob 000 0 eng d | ||
| 040 | |a KNOVL |b eng |e pn |c KNOVL |d OCLCA |d KNOVL |d OCLCQ |d CPO |d LIP |d OCLCQ |d OCLCF |d OTZ |d AU@ |d WYU |d UAB |d OCLCQ |d RDF |d OCLCA |d OCLCQ |d OCLCO |d OCLCQ |d OCLCO |d OCLCL | ||
| 020 | |a 9781621987383 |q (electronic bk.) | ||
| 020 | |a 1621987388 |q (electronic bk.) | ||
| 020 | |z 9780803175167 | ||
| 020 | |z 0803175167 | ||
| 024 | 7 | |a 10.1520/STP1530-EB |2 doi | |
| 035 | |a (OCoLC)853660052 |z (OCoLC)984595092 |z (OCoLC)990668076 |z (OCoLC)1007063079 |z (OCoLC)1055259755 |z (OCoLC)1065701876 | ||
| 245 | 0 | 0 | |a Lead-free solders / |c JAI guest editor, Narayan Prabu. |
| 260 | |a West Conshohocken, PA : |b ASTM International, |c ©2011. | ||
| 300 | |a 1 online resource (viii, 203 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Journal of ASTM International selected technical papers ; |v STP1530 | |
| 500 | |a "Sponsored by ASTM Committee D02 on Petroleum Products and Lubricants"--Page iii | ||
| 504 | |a Includes bibliographical references. | ||
| 506 | |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty | ||
| 520 | |a "Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover: Factors affecting the wetting behavior of solders and evolution of interfacial microstructure ; Pb-free high temperature solders for power semiconductor devices ; Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates ; Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling ; Microstructural aspects of the ductile-to-brittle transition ; Loading mixity on the interfacial failure mode in lead-free solder joint ; Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths. ; Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint ; Tensile properties of Sn-10Sb-5Cu high temperature lead free solder ; Empirical modeling and rheological characterization of solder pastes used in electronic assemblies. STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry."--Publisher's website | ||
| 505 | 0 | |a Wetting behavior of solders / G. Kumar, K. Narayan Prabhu -- A review of Pb-free High-temperature solders for power-semiconductor devices; Bi-base composite solder and Zn-Al-base solders / Y. Takakul, I. Ohnuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, K. Ishida -- Wetting behavior and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures / S. Narayan, K. Narayan Prabhu -- Solders joint reliability of SnBi finished TSOPs with Alloy 42 lead-frame under temperature cycling / W. Wang, M. Osterman, D. Das, M. Pecht -- The microstructural aspect of the ductile-to-brittle transition of tin-based lead-free solders / K. Lambrinou, W. Engelmaier -- Loading mixity on the interfacial failure mode in lead-free solder joint / F. Gao, J. Jing, F.Z, Liang, R.L. Williams, J. Qu -- Ball grid array lead-free solder joint strength under monotonic flexural load / P. Geng -- Tensile properties of Sn-10Sb-5Cu high temperature lead free solder / Q. Zeng, J. Guo, X. Gu, Q. Zhu, X. Liu -- Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications / S. Mallik, N.N. Ekere, R. Bhatti -- Rheological characterization and empirical modeling of lead-free solder pastes and isotropic conductive adhesive (ICA) pastes / R. Durairaj, L.W. Man, S. Ramesh. | |
| 590 | |a Knovel |b Knovel (All titles) | ||
| 650 | 0 | |a Lead-free electronics manufacturing processes. | |
| 650 | 0 | |a Solder and soldering |x Materials. | |
| 655 | 7 | |a elektronické knihy |7 fd186907 |2 czenas | |
| 655 | 9 | |a electronic books |2 eczenas | |
| 700 | 1 | |a Prabhu, Narayan. | |
| 710 | 2 | |a ASTM Committee D-2 on Petroleum Products and Lubricants. | |
| 776 | 0 | 8 | |i Print version: |t Lead-free solders. |d West Conshohocken, PA : ASTM International, ©2011 |z 9780803175167 |w (DLC) 2010053870 |w (OCoLC)698027265 |
| 830 | 0 | |a Journal of ASTM International. |p Selected technical papers ; |v STP 1530. | |
| 856 | 4 | 0 | |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpLFSSTP04/lead-free-solders?kpromoter=marc |y Full text |
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