rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: ISTFA 2012
    sub title: conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA
  name:
    name part: International Symposium for Testing and Failure Analysis 2012 : Phoenix Convention Center)
    role:
      role term: creator
  type of resource: text
  genre: bibliography
  genre: conference publication
  genre: elektronické knihy
  genre: electronic books
  origin info:
    place:
      place term: ohu
    place:
      place term: Materials Park, Ohio
    publisher: ASM International
    date issued: 2012
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (xxi, 620 pages) : illustrations (some color)
  table of contents: Title Page -- Copyright -- Board of Directors -- Organizing Committee -- Symposium Committee -- User Groups -- Contents -- 2012 IPFA Best Paper -- Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI -- Emerging Concepts and Techniques -- Closer to the Theoretical Limit: Spherical Corrections to Aplanatic Solid Immersion Imaging with Adaptive Optics -- Fault Isolation of Open Defects Using Space Domain Reflectometry -- Localization of Dead Open in a Solder Bump by Space Domain Reflectometry
  table of contents: Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip PackageNovel Plasma FIB/SEM for High Speed Failure Analysis and Real Time Imaging of Large Volume Removal -- FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices -- Fault Isolation and Failure Analysis of TSV -- Cross Section Analysis of Cu Filled TSVs Based On High Throughput Plasma- FIB Milling -- Microstructural Considerations on the Reliability of 3D Packaging
  table of contents: High-Frequency TSV Failure Detection Method with Z ParameterEnhanced Failure Analysis on Open TSV Interconnects -- Nanoprobing Techniques -- A New Technique for Non-Invasive Short-Localisation in Thin Dielectric Layers by Electron Beam Absorbed Current (EBAC) Imaging -- Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing -- In FAB 300 mm Wafer Level Atomic Force Probe Characterization -- Nanoelectronic Analog Circuit PFA â€? The Return of Circuit Level Probing -- Fault Isolation and Failure Analysis of 3D Packages
  table of contents: Enhanced Comparison of Lock-in Thermography and Magnetic Microscopy for 3D Defect Localization of System in PackagesNon Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-ray Computed Tomography -- Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies -- Nanoprobing Applications -- Analysis of an Anomalous Transistor Exhibiting Dual-Vt Characteristics and Its Cause in a 90 nm Node CMOS Technology
  table of contents: Study of Static Noise Margin, Cell Stability and Influence of Electron Beam on Sub-30 nm SRAM Using SEM-Based Nanoprobing with 8 NanoprobesLeaky Device Channel Anomaly Identification and Case Study by Nano-Probing Technique, Curve Fitting, and Model Analysis -- Photon Based Techniques: An Understanding -- Photon Emission Spectra of FETs as Obtained by InGaAs Detector -- Near-Infrared Photon Emission Spectroscopy Trends in Scaled SOI Technologies
  note: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
  note: Includes bibliographical references and index.
  subject:
    topic: Electronics
    topic: Materials
    topic: Testing
    genre: Congresses
  subject:
    topic: Electronic apparatus and appliances
    topic: Testing
    genre: Congresses
  related item:
    title info:
      title: ISTFA 2012 : Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis
    name:
      name part: International, ASM.
    origin info:
      publisher: Materials Park : A S M International, ©2012
  identifier: 9781615039951
  identifier: 1615039953
  identifier: 9781680155129
  identifier: 1680155121
  identifier: 1615039791
  identifier: 9781615039791
  identifier: https://proxy.k.utb.cz/login
  access condition: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
  record info:
    record content source: E7B
    record creation date: 121211
    record change date: 20240717213016.0
    record identifier: kn-ocn823729131
    language of cataloging:
      language term: eng