ISTFA 2012 : conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA.
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| Corporate Author: | |
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| Format: | eBook |
| Language: | English |
| Published: |
Materials Park, Ohio :
ASM International,
2012.
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| Subjects: | |
| ISBN: | 9781615039951 1615039953 9781680155129 1680155121 1615039791 9781615039791 |
| Physical Description: | 1 online resource (xxi, 620 pages) : illustrations (some color) |
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Table of contents
| LEADER | 05155cam a2200445Ma 4500 | ||
|---|---|---|---|
| 001 | kn-ocn823729131 | ||
| 003 | OCoLC | ||
| 005 | 20240717213016.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 121211s2012 ohuad ob 101 0 eng d | ||
| 040 | |a E7B |b eng |e pn |c E7B |d OCLCQ |d OCLCO |d YDXCP |d OCLCF |d OCLCO |d KNOVL |d OCLCQ |d OCL |d OCLCO |d EBLCP |d OCLCO |d OCLCQ |d OCLCO |d LOA |d MOR |d PIFPO |d N$T |d AGLDB |d MERUC |d OCLCQ |d ZCU |d U3W |d D6H |d STF |d WRM |d VTS |d COCUF |d NRAMU |d ICG |d INT |d VT2 |d OCLCQ |d DKC |d OCLCQ |d UKCRE |d AJS |d OCLCO |d OCLCQ |d OCLCO | ||
| 020 | |a 9781615039951 |q (electronic bk.) | ||
| 020 | |a 1615039953 |q (electronic bk.) | ||
| 020 | |a 9781680155129 |q (electronic bk.) | ||
| 020 | |a 1680155121 |q (electronic bk.) | ||
| 020 | |z 1615039791 | ||
| 020 | |z 9781615039791 | ||
| 035 | |a (OCoLC)823729131 |z (OCoLC)923571134 |z (OCoLC)929147927 |z (OCoLC)961603973 |z (OCoLC)962591977 |z (OCoLC)966218542 |z (OCoLC)988478579 |z (OCoLC)991928161 |z (OCoLC)1037910246 |z (OCoLC)1038658597 |z (OCoLC)1045514156 |z (OCoLC)1055375476 |z (OCoLC)1081218433 |z (OCoLC)1153487095 |z (OCoLC)1228540239 | ||
| 111 | 2 | |a International Symposium for Testing and Failure Analysis |n (38th : |d 2012 : |c Phoenix Convention Center) | |
| 245 | 1 | 0 | |a ISTFA 2012 : |b conference proceedings from the 38th International Symposium for Testing and Failure Analysis : November 11-15, 2012, Phoenix Convention Center, Phoenix, Arizona, USA. |
| 260 | |a Materials Park, Ohio : |b ASM International, |c 2012. | ||
| 300 | |a 1 online resource (xxi, 620 pages) : |b illustrations (some color) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Title Page -- Copyright -- Board of Directors -- Organizing Committee -- Symposium Committee -- User Groups -- Contents -- 2012 IPFA Best Paper -- Laser Voltage Probing in Failure Analysis of Advanced Integrated Circuits on SOI -- Emerging Concepts and Techniques -- Closer to the Theoretical Limit: Spherical Corrections to Aplanatic Solid Immersion Imaging with Adaptive Optics -- Fault Isolation of Open Defects Using Space Domain Reflectometry -- Localization of Dead Open in a Solder Bump by Space Domain Reflectometry | |
| 505 | 8 | |a Advanced Fault Isolation Technique Using Electro-Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D Flip-Chip PackageNovel Plasma FIB/SEM for High Speed Failure Analysis and Real Time Imaging of Large Volume Removal -- FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices -- Fault Isolation and Failure Analysis of TSV -- Cross Section Analysis of Cu Filled TSVs Based On High Throughput Plasma- FIB Milling -- Microstructural Considerations on the Reliability of 3D Packaging | |
| 505 | 8 | |a High-Frequency TSV Failure Detection Method with Z ParameterEnhanced Failure Analysis on Open TSV Interconnects -- Nanoprobing Techniques -- A New Technique for Non-Invasive Short-Localisation in Thin Dielectric Layers by Electron Beam Absorbed Current (EBAC) Imaging -- Precise Localization of 28 nm via Chain Resistive Defect Using EBAC and Nanoprobing -- In FAB 300 mm Wafer Level Atomic Force Probe Characterization -- Nanoelectronic Analog Circuit PFA � The Return of Circuit Level Probing -- Fault Isolation and Failure Analysis of 3D Packages | |
| 505 | 8 | |a Enhanced Comparison of Lock-in Thermography and Magnetic Microscopy for 3D Defect Localization of System in PackagesNon Destructive Failure Analysis of 3D Electronic Packages Using Both Electro Optical Terahertz Pulse Reflectometry and 3D X-ray Computed Tomography -- Failure Analysis Using Scanning Acoustic Microscopy for Diagnostics of Electronic Devices and 3D System Integration Technologies -- Nanoprobing Applications -- Analysis of an Anomalous Transistor Exhibiting Dual-Vt Characteristics and Its Cause in a 90 nm Node CMOS Technology | |
| 505 | 8 | |a Study of Static Noise Margin, Cell Stability and Influence of Electron Beam on Sub-30 nm SRAM Using SEM-Based Nanoprobing with 8 NanoprobesLeaky Device Channel Anomaly Identification and Case Study by Nano-Probing Technique, Curve Fitting, and Model Analysis -- Photon Based Techniques: An Understanding -- Photon Emission Spectra of FETs as Obtained by InGaAs Detector -- Near-Infrared Photon Emission Spectroscopy Trends in Scaled SOI Technologies | |
| 506 | |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty | ||
| 590 | |a Knovel |b Knovel (All titles) | ||
| 650 | 0 | |a Electronics |x Materials |x Testing |v Congresses. | |
| 650 | 0 | |a Electronic apparatus and appliances |x Testing |v Congresses. | |
| 655 | 7 | |a elektronické knihy |7 fd186907 |2 czenas | |
| 655 | 9 | |a electronic books |2 eczenas | |
| 776 | 0 | 8 | |i Print version: |a International, ASM. |t ISTFA 2012 : Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis. |d Materials Park : A S M International, ©2012 |z 9781615039791 |
| 856 | 4 | 0 | |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpISTFAC1O/istfa-2012-conference?kpromoter=marc |y Full text |
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