Introduction to semiconductor manufacturing technology
Integrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technologies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs tod...
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| Main Author | |
|---|---|
| Corporate Author | |
| Format | Electronic eBook |
| Language | English |
| Published |
Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) :
SPIE Press,
[2012]
|
| Edition | Second edition. |
| Series | SPIE monograph ;
PM220. |
| Subjects | |
| Online Access | Full text |
| ISBN | 9780819490933 0819490938 9781628701043 1628701048 9780819490926 081949092X |
| Physical Description | 1 online resource (xix, 656 pages) : illustrations |
Cover
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| 020 | |a 9781628701043 |q (electronic bk.) | ||
| 020 | |a 1628701048 |q (electronic bk.) | ||
| 020 | |z 9780819490926 |q (print) | ||
| 020 | |z 081949092X | ||
| 024 | 7 | |a 10.1117/3.924283 |2 doi | |
| 035 | |a (OCoLC)801513077 |z (OCoLC)830029110 |z (OCoLC)854970277 |z (OCoLC)868957930 |z (OCoLC)913039600 |z (OCoLC)961846162 |z (OCoLC)988616441 |z (OCoLC)999583668 |z (OCoLC)1065922697 |z (OCoLC)1086974359 |z (OCoLC)1124350583 |z (OCoLC)1127178228 |z (OCoLC)1136410292 | ||
| 100 | 1 | |a Xiao, Hong, |d 1961- |1 https://id.oclc.org/worldcat/entity/E39PCjwQT7B6MfcXrQcvvWpqpK | |
| 245 | 1 | 0 | |a Introduction to semiconductor manufacturing technology / |c Hong Xiao. |
| 250 | |a Second edition. | ||
| 264 | 1 | |a Bellingham, Wash. (1000 20th St. Bellingham WA 98225-6705 USA) : |b SPIE Press, |c [2012] | |
| 264 | 4 | |c ©2012 | |
| 300 | |a 1 online resource (xix, 656 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a SPIE Press monograph ; |v PM220 | |
| 500 | |a "SPIE Digital Library."--Website | ||
| 504 | |a Includes bibliographical references. | ||
| 505 | 0 | |a Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary. | |
| 506 | |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty | ||
| 520 | |a Integrated circuit fabrication is a complex process, and engineers must have a deep understanding of the intricate technologies involved in order to be successful. This book, intended for technical and college students, provides an overview of key concepts, equipment, and techniques used in fabs today. A history of the field is included as context for modern practictioners. The second edition covers advancements made in the past decade and adds new illustrations. | ||
| 590 | |a Knovel |b Knovel (All titles) | ||
| 650 | 0 | |a Integrated circuits |x Design and construction. | |
| 650 | 0 | |a Semiconductors |x Design and construction. | |
| 650 | 0 | |a Semiconductor industry. | |
| 655 | 7 | |a elektronické knihy |7 fd186907 |2 czenas | |
| 655 | 9 | |a electronic books |2 eczenas | |
| 710 | 2 | |a Society of Photo-Optical Instrumentation Engineers. | |
| 776 | 0 | 8 | |i Print version: |z 081949092X |z 9780819490926 |w (DLC) 2012013231 |
| 830 | 0 | |a SPIE monograph ; |v PM220. | |
| 856 | 4 | 0 | |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpISTE0002/introduction-to-semiconductor?kpromoter=marc |y Full text |