ISTFA 2011 : conference proceedings from the 37th International Symposium for Testing and Failure Analysis, November 13-17, 2011, San Jose Convention Center, San Jose, California
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| Corporate Authors: | , , , |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
Materials Park, OH :
ASM International,
2011.
|
| Subjects: | |
| ISBN: | 9781615038503 1615038507 9781680155112 1680155113 9781615038268 1615038264 0615038264 |
| Physical Description: | 1 online resource (xix, 456 pages) : illustrations |
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Table of contents
| LEADER | 05663cam a2200553 a 4500 | ||
|---|---|---|---|
| 001 | kn-ocn779364376 | ||
| 003 | OCoLC | ||
| 005 | 20240717213016.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 120306s2011 ohua ob 101 0 eng d | ||
| 040 | |a N$T |b eng |e pn |c N$T |d OCLCQ |d OCLCO |d YDXCP |d OCLCQ |d OCLCF |d OCLCO |d KNOVL |d OCL |d OCLCO |d OCLCQ |d OCLCO |d EBLCP |d OCLCO |d DEBSZ |d OCLCQ |d OCLCO |d JBG |d OCLCQ |d OCLCO |d AGLDB |d ZCU |d MERUC |d OCLCQ |d VTS |d ICG |d OCLCQ |d STF |d DKC |d OCLCQ |d M8D |d OCLCQ |d AJS |d OCLCQ |d OCLCO |d OCLCQ |d OCLCO | ||
| 020 | |a 9781615038503 |q (electronic bk.) | ||
| 020 | |a 1615038507 |q (electronic bk.) | ||
| 020 | |a 9781680155112 |q (electronic bk.) | ||
| 020 | |a 1680155113 |q (electronic bk.) | ||
| 020 | |z 9781615038268 | ||
| 020 | |z 1615038264 | ||
| 020 | |z 0615038264 |q (pbk.) | ||
| 035 | |a (OCoLC)779364376 |z (OCoLC)923571072 |z (OCoLC)929147929 | ||
| 111 | 2 | |a International Symposium for Testing and Failure Analysis |n (37th : |d 2011 : |c San Jose, Calif.) | |
| 245 | 1 | 0 | |a ISTFA 2011 : |b conference proceedings from the 37th International Symposium for Testing and Failure Analysis, November 13-17, 2011, San Jose Convention Center, San Jose, California / |c sponsored by EDFAS, ISTFA/2011, ASM International. |
| 246 | 3 | |a International Symposium for Testing and Failure Analysis 2011 | |
| 246 | 3 | 0 | |a Conference proceedings of the 37th International Symposium for Testing and Failure Analysis |
| 246 | 3 | 0 | |a 37th International Symposium for Testing and Failure Analysis |
| 246 | 3 | |a Thirty-seventh International Symposium for Testing and Failure Analysis | |
| 260 | |a Materials Park, OH : |b ASM International, |c 2011. | ||
| 300 | |a 1 online resource (xix, 456 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 500 | |a Some online versions lack accompanying media packaged with the printed version. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Title Page -- Copyright -- Contents -- IPFA 2011 Best Paper -- Electrical Failure and Damage Analysis of Multi-layer Metal Films on Flexible Substrate during Cyclic Bending Deformation -- Session 1: Emerging FA Techniques and Concepts -- A Position-Sensitive, Single-Photon Detector with Enhanced NIR Response -- Advanced Scan Chain Failure Analysis Using Laser Modulation Mapping and Continuous Wave Probing -- Thermal Frequency Imaging: A new application of Laser Voltage Imaging applied on 40nm technology | |
| 505 | 8 | |a Local Lattice Strain Measurement using Geometric Phase Analysis of Dark Field Images from Scanning Transmission Electron MicroscopyCorrecting for spherical aberrations in solid immersion microscopy using a deformable mirror -- Session 2: Circuit Edit -- The Challenges of Backside Focused Ion Beam (FIB) Editing in the Presence of Deep Trench Decoupling Capacitors -- State of the Art Substrate Manipulation As a Tool for Enhancing Product Performance -- Neon Ion Microscope Nanomachining Considerations | |
| 505 | 8 | |a Instant Solid Immersion Lens creation in silicon with a Focused Ion Beam- comparing refractive and diffractive methodsCircuit Edit and Optical Probe Development and Validation for Next Generation Process Nodes -- Session 3: Packaging and Assembly Level FA I -- 3DIC Fault Isolation Using the OBIRCH Approach -- Improving Wire Sweep Performance by Measuring Degree of Cure of Epoxy Mold Compounds -- Use of Lock-In Thermography for Non-Destructive 3D Defect Localization on System in Package and Stacked-Die Technology | |
| 505 | 8 | |a Quantitative Phase Shift Analysis for 3D Defect Localization Using Lock-in ThermographyFailure Analysis of Flip Chip C4 Package Using Focused Ion Beam Milling Technique -- Session 4: Test and Diagnostics -- Layout-aware Diagnosis Leads to Efficient and Effective Physical Failure Analysis -- Device Selection for Failure Analysis of Chain Fails Using Diagnosis Driven Yield Analysis -- Debugging an Invisible Flaky Scan Chain Defect -- Diagnose Compound Hold Time Faults Caused by Spot Delay Defects at Clock Tree -- Session 5: Defect Characterization and Metrology | |
| 505 | 8 | |a A Comprehensive Analysis Methodology for Gate Oxide Integrity Failure Using Combined FA TechniquesAl Bondpads, Halogens, and an ESCA-based Search for the Invisible Cause of Poor Throughput at Wafer Probe -- Whisker Formation in Copper Electroplating -- Comprehensive nano-structural approach of SSRM nanocontact on siliconthrough TEM-STEM study -- Highly Automated Transmission Electron Microscopy Tomography for Defect Understanding -- Transmission Electron Microscopy Characterization of FinFET � Understanding the 3D Structure by 2D Imaging Technique | |
| 506 | |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty | ||
| 590 | |a Knovel |b Knovel (All titles) | ||
| 650 | 0 | |a Electronics |x Materials |x Testing |v Congresses. | |
| 650 | 0 | |a Electronic apparatus and appliances |x Testing |v Congresses. | |
| 655 | 7 | |a elektronické knihy |7 fd186907 |2 czenas | |
| 655 | 9 | |a electronic books |2 eczenas | |
| 710 | 2 | |a Electronic Device Failure Analysis Society. | |
| 710 | 2 | |a International Symposium for Testing and Failure Analysis/2011. | |
| 710 | 2 | |a ASM International. | |
| 776 | 0 | 8 | |i Print version: |a International Symposium for Testing and Failure Analysis (37th : 2011 : San Jose, Calif.). |t ISTFA 2011. |d Materials Park, OH : ASM International, 2011 |z 9781615038268 |w (OCoLC)769470020 |
| 856 | 4 | 0 | |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpISTFAC0T/istfa-2011-conference?kpromoter=marc |y Full text |
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