http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
Adhesives technology for electronic applications
1 online resource (viii, 403 pages) : illustrations.
This text presents a comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, it includes new developments in anisotropic, electrically conductive, and underfill adhesives.
Machine generated contents note: 1.Introduction -- 2.Functions and theory of adhesives -- 3.Chemistry, Formulation, and Properties of Adhesives -- 4.Adhesive Bonding Processes -- 5.Applications -- 6.Reliability -- 7.Test and Inspection Methods.
Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
Includes bibliographical references and index.
Amsterdam ; Boston : William Andrew Pub., 2011
Materials and processes for electronic applications series