Lead-free solder interconnect reliability

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Bibliographic Details
Other Authors: Shangguan, Dongkai, 1963-
Format: eBook
Language: English
Published: Materials Park, OH : ASM International, 2005.
Subjects:
Microelectronic packaging > Reliability.
Solder and soldering.
Lead-free electronics manufacturing processes.
elektronické knihy
electronic books
ISBN: 9781615030934
161503093X
9780871708168
0871708167
Physical Description: 1 online resource (x, 292 pages) : illustrations

Cover

Table of contents

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020 |a 161503093X  |q (electronic bk.) 
020 |z 9780871708168 
020 |z 0871708167 
035 |a (OCoLC)729262390  |z (OCoLC)297986526  |z (OCoLC)764524457  |z (OCoLC)765135765  |z (OCoLC)858447454  |z (OCoLC)961570639  |z (OCoLC)962630422  |z (OCoLC)966147955  |z (OCoLC)988486457  |z (OCoLC)991914008  |z (OCoLC)999667400  |z (OCoLC)1037907637  |z (OCoLC)1038662416  |z (OCoLC)1045505736  |z (OCoLC)1055385671  |z (OCoLC)1060198896  |z (OCoLC)1064737787  |z (OCoLC)1081281043  |z (OCoLC)1087369832  |z (OCoLC)1124346248  |z (OCoLC)1153517311  |z (OCoLC)1194737472 
245 0 0 |a Lead-free solder interconnect reliability /  |c edited by Dongkai Shangguan. 
260 |a Materials Park, OH :  |b ASM International,  |c 2005. 
300 |a 1 online resource (x, 292 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
504 |a Includes bibliographical references and index. 
505 0 |a Contents -- Foreword -- Preface -- Lead-Free Soldering and Environmental Compliance: An Overview -- Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects -- Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties -- Lead-Free Solder Joint Reliability Trends -- Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects -- Tin Whisker Growth on Lead-Free Solder Finishes -- Accelerated Testing Methodology for Lead-Free Solder Interconnects 
505 8 |a Thermomechanical Reliability Prediction of Lead-Free Solder InterconnectsDesign for Reliabilityâ€?Finite Element Modeling of Lead-Free Solder Interconnects -- Characterization and Failure Analyses of Lead-Free Solder Defects -- Reliability of Interconnects with Conductive Adhesives -- Lead-Free Solder Interconnect Reliability Outlook -- Index 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Microelectronic packaging  |x Reliability. 
650 0 |a Solder and soldering. 
650 0 |a Lead-free electronics manufacturing processes. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Shangguan, Dongkai,  |d 1963- 
776 0 8 |i Print version:  |t Lead-free solder interconnect reliability.  |d Materials Park, OH : ASM International, 2005  |z 0871708167  |w (DLC) 2005050106  |w (OCoLC)60543308 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpLFSIR005/lead-free-solder?kpromoter=marc  |y Full text 

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