Lead-free solder interconnect reliability

Saved in:
Bibliographic Details
Other Authors: Shangguan, Dongkai, 1963-
Format: eBook
Language: English
Published: Materials Park, OH : ASM International, 2005.
Subjects:
Microelectronic packaging > Reliability.
Solder and soldering.
Lead-free electronics manufacturing processes.
elektronické knihy
electronic books
ISBN: 9781615030934
161503093X
9780871708168
0871708167
Physical Description: 1 online resource (x, 292 pages) : illustrations

Cover

Table of contents

Description
Bibliography: Includes bibliographical references and index.
ISBN: 9781615030934
161503093X
9780871708168
0871708167
Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty

Similar Items