Lead-free solder interconnect reliability

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Bibliographic Details
Other Authors Shangguan, Dongkai, 1963-
Format Electronic eBook
LanguageEnglish
Published Materials Park, OH : ASM International, 2005.
Subjects
Microelectronic packaging > Reliability.
Solder and soldering.
Lead-free electronics manufacturing processes.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781615030934
161503093X
9780871708168
0871708167
Physical Description1 online resource (x, 292 pages) : illustrations

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More Information
Bibliography:Includes bibliographical references and index.
ISBN:9781615030934
161503093X
9780871708168
0871708167
Access:Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
Physical Description:1 online resource (x, 292 pages) : illustrations

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