MEMS packaging

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industrie...

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Bibliographic Details
Corporate Author INSPEC (Information service)
Other Authors Hsu, Tai-Ran
Format Electronic eBook
LanguageEnglish
Published London : INSPEC, ©2004.
SeriesEMIS processing series ; no. 3.
Subjects
Microelectromechanical systems.
Microelectronic packaging.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781849190626
1849190623
9781615839629
1615839623
1282275119
9781282275119
9786612275111
6612275111
0863413358
9780863413353
Physical Description1 online resource (xxix, 275 pages) : illustrations

Cover

Table of Contents:
  • Editor; Authors; Abbreviations; Introductory statements; Introduction; 1. Fundamentals of MEMS packaging; 2. Joining and bonding technologies; 3. Sealing technologies; 4. Packing of microsystems; 5. Automated microassembly; 6. Testing and design for test; 7. MEMS packaging in the life sciences; 8. RF and optical packaging in telecommunications and other applications; 9. Aerospace applications; Appendix 1: Glossary; Appendix 2: Other resources; Subject Index

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