rdf-syntax-grammar
mods:
  schema location: http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-2.xsd
  title info:
    title: MEMS packaging
  name:
    name part: Hsu, Tai-Ran.
  name:
    name part: INSPEC (Information service)
  type of resource: text
  genre: bibliography
  genre: elektronické knihy
  genre: electronic books
  origin info:
    place:
      place term: enk
    place:
      place term: London
    publisher: INSPEC
    date issued: ©2004
    date issued: 2004
    issuance: monographic
  language:
    language term: eng
  physical description:
    form: remote
    extent: 1 online resource (xxix, 275 pages) : illustrations
  abstract: MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing. The Institution of Engineering and Technology is.
  table of contents: Editor; Authors; Abbreviations; Introductory statements; Introduction; 1. Fundamentals of MEMS packaging; 2. Joining and bonding technologies; 3. Sealing technologies; 4. Packing of microsystems; 5. Automated microassembly; 6. Testing and design for test; 7. MEMS packaging in the life sciences; 8. RF and optical packaging in telecommunications and other applications; 9. Aerospace applications; Appendix 1: Glossary; Appendix 2: Other resources; Subject Index
  note: edited by Tai-Ran Hsu.
  note: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
  note: Includes bibliographical references and index.
  subject:
    topic: Microelectromechanical systems
  subject:
    topic: Microelectronic packaging
  related item:
    title info:
      title: MEMS packaging
    origin info:
      publisher: London : INSPEC, ©2004
    identifier: (OCoLC)53030765
  related item:
    title info:
      title: EMIS processing series ; no. 3
  identifier: 9781849190626
  identifier: 1849190623
  identifier: 9781615839629
  identifier: 1615839623
  identifier: 1282275119
  identifier: 9781282275119
  identifier: 9786612275111
  identifier: 6612275111
  identifier: 0863413358
  identifier: 9780863413353
  identifier: https://proxy.k.utb.cz/login
  access condition: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
  record info:
    record content source: N$T
    record creation date: 101213
    record change date: 20240717213016.0
    record identifier: kn-ocn692197050
    language of cataloging:
      language term: eng