MEMS packaging

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industrie...

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Bibliographic Details
Corporate Author: INSPEC (Information service)
Other Authors: Hsu, Tai-Ran.
Format: eBook
Language: English
Published: London : INSPEC, ©2004.
Series: EMIS processing series ; no. 3.
Subjects:
Microelectromechanical systems.
Microelectronic packaging.
elektronické knihy
electronic books
ISBN: 9781849190626
1849190623
9781615839629
1615839623
1282275119
9781282275119
9786612275111
6612275111
0863413358
9780863413353
Physical Description: 1 online resource (xxix, 275 pages) : illustrations

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Table of contents

LEADER 03661cam a2200505 a 4500
001 kn-ocn692197050
003 OCoLC
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006 m o d
007 cr cn|||||||||
008 101213s2004 enka ob 001 0 eng d
040 |a N$T  |b eng  |e pn  |c N$T  |d OCLCE  |d E7B  |d OCLCQ  |d B24X7  |d OCLCQ  |d Z@L  |d CUS  |d OCLCQ  |d KNOVL  |d DEBSZ  |d ZCU  |d OCLCF  |d COO  |d KNOVL  |d YDXCP  |d CNNAI  |d OCLCQ  |d AGLDB  |d OCLCQ  |d VTS  |d CEF  |d RRP  |d OCLCO  |d AU@  |d OCLCO  |d YOU  |d STF  |d OL$  |d OCLCQ  |d HS0  |d ERF  |d UKBTH  |d S2H  |d OCLCQ  |d BRF  |d MM9  |d UAB  |d OCLCQ  |d CNNOR  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCL  |d SXB 
020 |a 9781849190626  |q (electronic bk.) 
020 |a 1849190623  |q (electronic bk.) 
020 |a 9781615839629  |q (electronic bk.) 
020 |a 1615839623  |q (electronic bk.) 
020 |a 1282275119 
020 |a 9781282275119 
020 |a 9786612275111 
020 |a 6612275111 
020 |z 0863413358 
020 |z 9780863413353 
035 |a (OCoLC)692197050  |z (OCoLC)607067497  |z (OCoLC)646557769  |z (OCoLC)646822679  |z (OCoLC)729386039  |z (OCoLC)858447456  |z (OCoLC)978429488  |z (OCoLC)978866904  |z (OCoLC)1044328643  |z (OCoLC)1047938230  |z (OCoLC)1056439289  |z (OCoLC)1060902122  |z (OCoLC)1074315930  |z (OCoLC)1102559762  |z (OCoLC)1108923615  |z (OCoLC)1113055363  |z (OCoLC)1116144675  |z (OCoLC)1119128678  |z (OCoLC)1136392163  |z (OCoLC)1157032404  |z (OCoLC)1157555248  |z (OCoLC)1159647487  |z (OCoLC)1178680968  |z (OCoLC)1183864769  |z (OCoLC)1224452610  |z (OCoLC)1249100278 
042 |a dlr 
245 0 0 |a MEMS packaging /  |c edited by Tai-Ran Hsu. 
260 |a London :  |b INSPEC,  |c ©2004. 
300 |a 1 online resource (xxix, 275 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
490 1 |a EMIS processing series ;  |v no. 3 
504 |a Includes bibliographical references and index. 
505 0 |a Editor; Authors; Abbreviations; Introductory statements; Introduction; 1. Fundamentals of MEMS packaging; 2. Joining and bonding technologies; 3. Sealing technologies; 4. Packing of microsystems; 5. Automated microassembly; 6. Testing and design for test; 7. MEMS packaging in the life sciences; 8. RF and optical packaging in telecommunications and other applications; 9. Aerospace applications; Appendix 1: Glossary; Appendix 2: Other resources; Subject Index 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing. The Institution of Engineering and Technology is. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Microelectromechanical systems. 
650 0 |a Microelectronic packaging. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Hsu, Tai-Ran. 
710 2 |a INSPEC (Information service) 
776 0 8 |i Print version:  |t MEMS packaging.  |d London : INSPEC, ©2004  |z 0863413358  |w (OCoLC)53030765 
830 0 |a EMIS processing series ;  |v no. 3. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpMEMSP002/mems-packaging?kpromoter=marc  |y Full text 

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