MEMS packaging

MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industrie...

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Bibliographic Details
Corporate Author: INSPEC (Information service)
Other Authors: Hsu, Tai-Ran.
Format: eBook
Language: English
Published: London : INSPEC, ©2004.
Series: EMIS processing series ; no. 3.
Subjects:
Microelectromechanical systems.
Microelectronic packaging.
elektronické knihy
electronic books
ISBN: 9781849190626
1849190623
9781615839629
1615839623
1282275119
9781282275119
9786612275111
6612275111
0863413358
9780863413353
Physical Description: 1 online resource (xxix, 275 pages) : illustrations

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Summary: MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing. The Institution of Engineering and Technology is.
Bibliography: Includes bibliographical references and index.
ISBN: 9781849190626
1849190623
9781615839629
1615839623
1282275119
9781282275119
9786612275111
6612275111
0863413358
9780863413353
Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty

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