Medical Device Materials III : Proceedings from the Materials & Processes for Medical Devices Conference 2005, November 14-16, 2005, Boston, Massachusetts, USA

The Materials & Processes for Medical Devices Conference focuses on the materials science and engineering aspects of the medical devices industry. Device manufacturers, materials providers, and clinicians share information and knowledge on materials and their properties. Coverage ranges from car...

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Bibliographic Details
Corporate Author: Materials & Processes for Medical Devices Conference Boston, Mass.)
Other Authors: Venugopalan, Ramakrishna., Wu, Ming Hsiung.
Format: eBook
Language: English
Published: Materials Park, OH : ASM International, ©2006.
Subjects:
Biomedical materials > Congresses.
Biomedical engineering > Congresses.
Biomedical engineering.
elektronické knihy
electronic books
ISBN: 9781615031153
1615031154
9781628702101
1628702109
9780871708458
0871708450
Physical Description: 1 online resource (ix, 250 pages) : illustrations

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Table of contents

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003 OCoLC
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006 m o d
007 cr cn|||||||||
008 070206s2006 ohua ob 101 0 eng d
040 |a E7B  |b eng  |e pn  |c E7B  |d OCLCQ  |d YDXCP  |d N$T  |d OCLCQ  |d OCLCF  |d KNOVL  |d OCLCO  |d ZCU  |d OCLCQ  |d NLGGC  |d COO  |d KNOVL  |d OCL  |d OCLCO  |d EBLCP  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCQ  |d OCLCO  |d NKT  |d STF  |d OCLCO  |d AZK  |d OCLCO  |d JBG  |d OCLCO  |d OCLCA  |d OCLCQ  |d OCLCO  |d COCUF  |d TOA  |d U3G  |d OCLCO  |d AGLDB  |d OCLCO  |d MOR  |d PIFAG  |d MERUC  |d OCLCQ  |d YDX  |d OCLCQ  |d OCLCO  |d OCLCA  |d U3W  |d BUF  |d MERER  |d CUY  |d OCLCQ  |d DKU  |d WRM  |d VNS  |d OCLCO  |d VTS  |d CEF  |d RRP  |d OCLCQ  |d ICG  |d NRAMU  |d VT2  |d AU@  |d OCLCO  |d OCLCQ  |d REC  |d WYU  |d TKN  |d OCLCO  |d OCLCQ  |d DKC  |d OCLCO  |d OCLCQ  |d OCLCO  |d M8D  |d OCLCO  |d OCLCQ  |d OCLCA  |d UKCRE  |d MM9  |d OCLCQ  |d ERD  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCL 
020 |a 9781615031153  |q (electronic bk.) 
020 |a 1615031154  |q (electronic bk.) 
020 |a 9781628702101  |q (electronic bk.) 
020 |a 1628702109  |q (electronic bk.) 
020 |z 9780871708458 
020 |z 0871708450 
035 |a (OCoLC)647829214  |z (OCoLC)764524408  |z (OCoLC)781639135  |z (OCoLC)923570639  |z (OCoLC)929147692  |z (OCoLC)961550819  |z (OCoLC)962617970  |z (OCoLC)973355314  |z (OCoLC)988473201  |z (OCoLC)991958613  |z (OCoLC)1037902566  |z (OCoLC)1038618942  |z (OCoLC)1045524716  |z (OCoLC)1063812473  |z (OCoLC)1153460715  |z (OCoLC)1228600174 
111 2 |a Materials & Processes for Medical Devices Conference  |n (3rd :  |d 2005 :  |c Boston, Mass.) 
245 1 0 |a Medical Device Materials III :  |b Proceedings from the Materials & Processes for Medical Devices Conference 2005, November 14-16, 2005, Boston, Massachusetts, USA /  |c edited by Ramakrishna Venugopalan, Ming Wu ; sponsored by ASM International. 
260 |a Materials Park, OH :  |b ASM International,  |c ©2006. 
300 |a 1 online resource (ix, 250 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
500 |a "SAN 204-7586"--Title page verso 
504 |a Includes bibliographical references and author index. 
505 0 |a Preface -- CONTENTS -- Materials R & D-Metallic Alloys -- Materials R & D-Metallic Biomaterials -- Fabrication Processes -- MIM & Powder Processes -- Fatigue -- Surface Engineering -- Corrosion and Biocompatibility -- Numerical Modeling -- Device Design and Applications -- Author Index 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a The Materials & Processes for Medical Devices Conference focuses on the materials science and engineering aspects of the medical devices industry. Device manufacturers, materials providers, and clinicians share information and knowledge on materials and their properties. Coverage ranges from cardiovascular devices to orthopedics to dental appliances. --  |c Provided by publisher. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Biomedical materials  |v Congresses. 
650 0 |a Biomedical engineering  |v Congresses. 
650 0 |a Biomedical engineering. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Venugopalan, Ramakrishna. 
700 1 |a Wu, Ming Hsiung. 
776 0 8 |i Print version:  |a Materials & Processes for Medical Devices Conference (3rd : 2005 : Boston, Mass.).  |t Medical device materials III.  |d Materials Park, OH : ASM International, ©2006  |w (DLC) 2007271628 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpMDMIIIP2/medical-device-materials?kpromoter=marc  |y Full text 

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