Soldering in electronics assembly
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a phot...
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| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | eBook |
| Language: | English |
| Published: |
Oxford ; Boston :
Newnes,
1999.
|
| Edition: | 2nd ed. |
| Subjects: | |
| ISBN: | 9780750635455 0750635452 9780080517346 008051734X 128107134X 9781281071347 9786611071349 6611071342 |
| Physical Description: | 1 online resource (xi, 369 pages) : illustrations |
Cover
Table of contents
| LEADER | 04441cam a2200457 a 4500 | ||
|---|---|---|---|
| 001 | kn-ocn162589653 | ||
| 003 | OCoLC | ||
| 005 | 20240717213016.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 070806s1999 enka ob 001 0 eng d | ||
| 040 | |a OPELS |b eng |e pn |c OPELS |d OCLCQ |d N$T |d YDXCP |d IDEBK |d E7B |d KNOVL |d OCLCQ |d OCLCO |d OCLCQ |d UMI |d KNOVL |d DEBSZ |d OCLCO |d KNOVL |d OCLCQ |d OCLCO |d OCLCF |d OCLCO |d OCLCQ |d OCLCO |d OCLCQ |d OCLCO |d COO |d OCLCO |d OCLCQ |d OCLCO |d OCLCQ |d OCLCO |d STF |d D6H |d OCLCO |d CEF |d OCLCQ |d LEAUB |d OCLCO |d UKBTH |d LUN |d VT2 |d OCLCQ |d COM |d OCLCO |d OCLCQ |d OCLCO |d OCLCL | ||
| 020 | |a 9780750635455 | ||
| 020 | |a 0750635452 | ||
| 020 | |a 9780080517346 |q (electronic bk.) | ||
| 020 | |a 008051734X |q (electronic bk.) | ||
| 020 | |a 128107134X | ||
| 020 | |a 9781281071347 | ||
| 020 | |a 9786611071349 | ||
| 020 | |a 6611071342 | ||
| 035 | |a (OCoLC)162589653 |z (OCoLC)182729028 |z (OCoLC)648331333 |z (OCoLC)758464551 |z (OCoLC)824151996 |z (OCoLC)1035656419 |z (OCoLC)1113467671 |z (OCoLC)1159633958 |z (OCoLC)1202553811 |z (OCoLC)1240523287 | ||
| 100 | 1 | |a Judd, Mike. | |
| 245 | 1 | 0 | |a Soldering in electronics assembly / |c Mike Judd and Keith Brindley. |
| 250 | |a 2nd ed. | ||
| 260 | |a Oxford ; |a Boston : |b Newnes, |c 1999. | ||
| 300 | |a 1 online resource (xi, 369 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 506 | |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty | ||
| 520 | |a Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert UK, Director of Marketing Europe for Electrovert, part of the Cookson Group, and Director of OEM at Speedline. Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment. | ||
| 505 | 0 | |a Soldering process; Electronics assemblies; Solder; Flux; CS soldering processes; SC soldering processes; BGA technology; Cleaning of soldered assemblies; Avoiding problems -- soldering quality; Standards and specifications; Glossary; References; Worldwide addresses; Appendices: Why not blame the machine?, Problems and solutions, Soldering safety, Comparing soldering processes and machines; Index. | |
| 504 | |a Includes bibliographical references (pages 313-316) and index. | ||
| 590 | |a Knovel |b Knovel (All titles) | ||
| 650 | 0 | |a Printed circuits |x Design and construction. | |
| 650 | 0 | |a Solder and soldering. | |
| 655 | 7 | |a elektronické knihy |7 fd186907 |2 czenas | |
| 655 | 9 | |a electronic books |2 eczenas | |
| 700 | 1 | |a Brindley, Keith. | |
| 776 | 0 | 8 | |i Print version: |a Judd, Mike. |t Soldering in electronics assembly. |b 2nd ed. |d Oxford ; Boston : Newnes, 1999 |z 0750635452 |z 9780750635455 |w (DLC) 99224069 |w (OCoLC)42934451 |
| 856 | 4 | 0 | |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpSEAE0002/soldering-in-electronics?kpromoter=marc |y Full text |
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