Handbook of thin-film deposition processes and techniques : principles, methods, equipment and applications
The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers...
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| Other Authors: | |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
Norwich, N.Y. :
Noyes Publications/William Andrew Pub.,
©2002.
|
| Edition: | 2nd ed. |
| Series: | Materials science and process technology series. Electronic materials and process technology.
|
| Subjects: | |
| ISBN: | 1591241936 9781591241935 9780815517788 0815517785 9780815517764 0815517769 9780815514428 0815514425 0429076746 9780429076749 1482269686 9781482269680 1282253190 9781282253193 9786612253195 6612253193 9786612253188 6612253185 |
| Physical Description: | 1 online resource (xxviii, 629 pages) : illustrations. |
Cover
Table of contents
| LEADER | 04705cam a2200601Ma 4500 | ||
|---|---|---|---|
| 001 | kn-ocm49708503 | ||
| 003 | OCoLC | ||
| 005 | 20240717213016.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 020123s2002 nyua obf 001 0 eng d | ||
| 040 | |a KNOVL |b eng |e pn |c KNOVL |d OCLCQ |d TEF |d OCLCQ |d SHH |d OCLCQ |d VLB |d OPELS |d N$T |d YDXCP |d UBY |d UWW |d IDEBK |d AU@ |d E7B |d QE2 |d B24X7 |d OCLCQ |d KNOVL |d OCLCO |d ZCU |d KNOVL |d OCLCF |d COO |d OCLCQ |d KNOVL |d OCL |d OCLCQ |d TEF |d VT2 |d OCLCQ |d UAB |d BUF |d D6H |d YDX |d OCLCQ |d CEF |d RRP |d WYU |d LEAUB |d S9I |d UKAHL |d SFB |d EYM |d COM |d OCLCO |d OCLCQ |d OCLCO |d OCLCL |d OCLCQ | ||
| 020 | |a 1591241936 |q (electronic bk.) | ||
| 020 | |a 9781591241935 |q (electronic bk.) | ||
| 020 | |a 9780815517788 |q (electronic bk.) | ||
| 020 | |a 0815517785 |q (electronic bk.) | ||
| 020 | |a 9780815517764 |q (electronic bk.) | ||
| 020 | |a 0815517769 |q (electronic bk.) | ||
| 020 | |z 9780815514428 | ||
| 020 | |z 0815514425 | ||
| 020 | |a 0429076746 | ||
| 020 | |a 9780429076749 | ||
| 020 | |a 1482269686 | ||
| 020 | |a 9781482269680 | ||
| 020 | |a 1282253190 | ||
| 020 | |a 9781282253193 | ||
| 020 | |a 9786612253195 | ||
| 020 | |a 6612253193 | ||
| 020 | |a 9786612253188 | ||
| 020 | |a 6612253185 | ||
| 035 | |a (OCoLC)49708503 |z (OCoLC)49411049 |z (OCoLC)271043837 |z (OCoLC)281603397 |z (OCoLC)303292812 |z (OCoLC)471136041 |z (OCoLC)505118548 |z (OCoLC)647800831 |z (OCoLC)961882799 |z (OCoLC)988680198 |z (OCoLC)993527864 |z (OCoLC)999450173 |z (OCoLC)999656345 |z (OCoLC)1057991868 |z (OCoLC)1060196248 |z (OCoLC)1065847401 |z (OCoLC)1105855333 |z (OCoLC)1136371819 |z (OCoLC)1194777210 | ||
| 245 | 0 | 0 | |a Handbook of thin-film deposition processes and techniques : |b principles, methods, equipment and applications / |c edited by Krishna Seshan. |
| 250 | |a 2nd ed. | ||
| 260 | |a Norwich, N.Y. : |b Noyes Publications/William Andrew Pub., |c ©2002. | ||
| 300 | |a 1 online resource (xxviii, 629 pages) : |b illustrations. | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Materials science and process technology series. Electronic materials and process technology | |
| 506 | |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty | ||
| 520 | |a The 2nd edition contains new chapters on contamination and contamination control that describe the basics and the issues. Another new chapter on meteorology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together physical vapor deposition techniques. Two entirely new areas are focused on: chemical mechanical polishing, which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Foreword: Gordon Moore -- Recent Changes in the Semiconductor Industry -- Deposition Technologies and Applications: Introduction and Overview -- Silicon Epitaxy by Chemical Vapor Deposition -- Chemical Vapor Deposition of Silicon Dioxide Films -- Metal Organic Chemical Vapor Deposition -- Feature Scale Modeling -- The Role of Metrology and Inspection to Semiconductor Processing -- Contamination Control, Defect Detection and Yield Enhancement in Gigabit Manufacturing -- Sputtering and Sputter Deposition -- Laser and Electron Beam Assisted Processing -- Molecular Beam Epitaxy: Equipment and Practice -- Ion Beam Deposition -- Chemical Mechanical Polishing -- Organic Dielectrics in Multilevel Metallization of Integrated Circuits -- Performance, Processing, and Lithography Trends -- Index. | |
| 590 | |a Knovel |b Knovel (All titles) | ||
| 650 | 0 | |a Thin film devices |x Design and construction |v Handbooks, manuals, etc. | |
| 650 | 0 | |a Thin films |v Handbooks, manuals, etc. | |
| 650 | 0 | |a Chemical vapor deposition |v Handbooks, manuals, etc. | |
| 655 | 7 | |a elektronické knihy |7 fd186907 |2 czenas | |
| 655 | 9 | |a electronic books |2 eczenas | |
| 700 | 1 | |a Seshan, Krishna. | |
| 776 | 0 | 8 | |i Print version: |t Handbook of thin-film deposition processes and techniques : principles, methods, equipment and applications. |d Norwich, N.Y. : Noyes Publications/William Andrew Pub., 2002 |z 0815514425 |w (DLC) 2001135178 |w (OCoLC)42960492 |
| 830 | 0 | |a Materials science and process technology series. |p Electronic materials and process technology. | |
| 856 | 4 | 0 | |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpHTFDPTP1/handbook-of-thin?kpromoter=marc |y Full text |
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