Hybrid microcircuit technology handbook : materials, processes, design, testing and production

Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis...

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Bibliographic Details
Main Author Licari, James J., 1930-
Other Authors Enlow, Leonard R.
Format eBook
LanguageEnglish
Published Westwood, N.J. : Noyes Publicatons, ©1998.
Edition2nd ed.
SeriesMaterials science and process technology series.
Subjects
Hybrid integrated circuits > Design and construction > Handbooks, manuals, etc.
elektronické knihy
electronic books
Online AccessFull text
ISBN159124255X
9781591242550
9780815514237
0815514239
9780815519843
0815519842
9780080946597
0080946593
1282711733
9781282711730
9786612711732
6612711736
9786612011047
6612011041
9780815517986
Physical Description1 online resource (xxi, 579 pages) : illustrations

Cover

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100 1 |a Licari, James J.,  |d 1930-  |1 https://id.oclc.org/worldcat/entity/E39PCjFcjWxggdTwcQ4fPhJvH3 
245 1 0 |a Hybrid microcircuit technology handbook :  |b materials, processes, design, testing and production /  |c by James J. Licari and Leonard R. Enlow. 
250 |a 2nd ed. 
260 |a Westwood, N.J. :  |b Noyes Publicatons,  |c ©1998. 
300 |a 1 online resource (xxi, 579 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a computer disc  |b cd  |2 rdacarrier 
490 1 |a Materials science and process technology series 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines is also present. 
504 |a Includes bibliographical references and index. 
505 0 |a Introduction -- Substrates -- Thin Film Processes -- Thick Film Processes -- Resistor Trimming -- Parts Selection -- Assembly Processes -- Testing -- Handling and Clean Rooms -- Design Guidelines -- Documentation and Specifications -- Failure Analysis -- Multichip Modules: A New Breed of Hybrid Microcircuits -- References -- Index. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Hybrid integrated circuits  |x Design and construction  |v Handbooks, manuals, etc. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Enlow, Leonard R. 
776 0 8 |i Print version:  |a Licari, James J., 1930-  |t Hybrid microcircuit technology handbook.  |b 2nd ed.  |d Westwood, N.J. : Noyes Publicatons, ©1998  |z 0815514239  |w (DLC) 98006322  |w (OCoLC)38573122 
830 0 |a Materials science and process technology series. 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpHMTHE001/hybrid-microcircuit-technology?kpromoter=marc  |y Full text 

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