Surface preparation techniques for adhesive bonding

Provides information on processing adherends prior to adhesive bonding from the point of view of the materials and process engineer. Processing of aluminum and its alloys, titanium and its alloys, steels, copper and its alloys, and magnesium are treated in the form of detailed specifications with co...

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Bibliographic Details
Main Author: Wegman, Raymond F.
Format: eBook
Language: English
Published: Park Ridge, N.J., U.S.A. : Noyes Publications, ©1989.
Edition: Reprint ed.
Subjects:
Surface preparation.
Adhesives.
elektronické knihy
electronic books
ISBN: 1591241553
9781591241553
9780815511984
0815511981
9780815519133
0815519133
Physical Description: 1 online resource (xxii, 150 pages) : illustrations

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Table of contents

LEADER 02426cam a2200409Ma 4500
001 kn-ocm49708276
003 OCoLC
005 20240717213016.0
006 m o d
007 cr cn|||||||||
008 011112s1989 njua ob 001 0 eng d
040 |a KNOVL  |b eng  |e pn  |c KNOVL  |d OCLCQ  |d TEF  |d OCLCQ  |d DEBSZ  |d OCLCQ  |d KNOVL  |d ZCU  |d KNOVL  |d OCLCF  |d OCLCQ  |d OCLCO  |d N$T  |d IDEBK  |d KNOVL  |d OCLCQ  |d BUF  |d CEF  |d AU@  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCL  |d SXB 
020 |a 1591241553  |q (electronic bk.) 
020 |a 9781591241553  |q (electronic bk.) 
020 |a 9780815511984 
020 |a 0815511981 
020 |a 9780815519133  |q (electronic bk.) 
020 |a 0815519133  |q (electronic bk.) 
035 |a (OCoLC)49708276  |z (OCoLC)49270704  |z (OCoLC)309071387  |z (OCoLC)1058070522 
100 1 |a Wegman, Raymond F. 
245 1 0 |a Surface preparation techniques for adhesive bonding /  |c by Raymond F. Wegman. 
250 |a Reprint ed. 
260 |a Park Ridge, N.J., U.S.A. :  |b Noyes Publications,  |c ©1989. 
300 |a 1 online resource (xxii, 150 pages) :  |b illustrations 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a Provides information on processing adherends prior to adhesive bonding from the point of view of the materials and process engineer. Processing of aluminum and its alloys, titanium and its alloys, steels, copper and its alloys, and magnesium are treated in the form of detailed specifications with comparative data. Other metals not requiring extensive treatment are covered, as are metal matrix and organic matrix composites, thermosets and thermoplastics. 
504 |a Includes bibliographical references and index. 
590 |a Knovel  |b Knovel (All titles) 
650 0 |a Surface preparation. 
650 0 |a Adhesives. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
776 0 8 |i Print version:  |a Wegman, Raymond F.  |t Surface preparation techniques for adhesive bonding.  |b Reprint ed.  |d Park Ridge, N.J., U.S.A. : Noyes Publications, ©1989  |z 0815511981  |w (DLC) 88034528  |w (OCoLC)18908371 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://app.knovel.com/hotlink/toc/id:kpSPTAB003/surface-preparation-techniques?kpromoter=marc  |y Full text 

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