RF and microwave microelectronics packaging II

Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers T...

Full description

Saved in:
Bibliographic Details
Other Authors: Kuang, Ken, (Editor), Sturdivant, Rick, (Editor)
Format: eBook
Language: English
Published: Cham, Switzerland : Springer, 2017.
Subjects:
Microelectronic packaging.
elektronické knihy
electronic books
ISBN: 9783319516974
9783319516967
Physical Description: 1 online resource (xii, 172 pages) : illustrations (some color)

Cover

Table of contents

LEADER 06373cam a2200469Ii 4500
001 99916
003 CZ-ZlUTB
005 20240914112347.0
006 m o d
007 cr cnu---unuuu
008 170322s2017 sz a ob 001 0 eng d
040 |a GW5XE  |b eng  |e rda  |e pn  |c GW5XE  |d N$T  |d YDX  |d EBLCP  |d IDEBK  |d OCLCF  |d IOG  |d COO  |d AZU  |d UPM  |d UAB  |d ESU  |d JBG  |d IAD  |d ICW  |d ICN  |d OTZ  |d VT2  |d OCLCQ  |d IDB  |d U3W  |d MERUC  |d CAUOI  |d KSU  |d EZ9  |d WYU  |d OCLCQ  |d UKMGB  |d AUD  |d UKAHL  |d OCLCQ  |d ERF  |d UKBTH  |d LEATE  |d OCLCQ 
020 |a 9783319516974  |q (electronic bk.) 
020 |z 9783319516967  |q (print) 
024 7 |a 10.1007/978-3-319-51697-4  |2 doi 
035 |a (OCoLC)978270935  |z (OCoLC)975960776  |z (OCoLC)976133476  |z (OCoLC)976331100  |z (OCoLC)978530520  |z (OCoLC)978626472  |z (OCoLC)978749274  |z (OCoLC)979069498  |z (OCoLC)979230365  |z (OCoLC)979277289  |z (OCoLC)979505092  |z (OCoLC)984861271  |z (OCoLC)999548784  |z (OCoLC)1005792520  |z (OCoLC)1011793151  |z (OCoLC)1048183857  |z (OCoLC)1066459081  |z (OCoLC)1086456916  |z (OCoLC)1112589538  |z (OCoLC)1112967374  |z (OCoLC)1113421935  |z (OCoLC)1117253729  |z (OCoLC)1122813598  |z (OCoLC)1127187353 
245 0 0 |a RF and microwave microelectronics packaging II /  |c Ken Kuang, Rick Sturdivant, editors. 
264 1 |a Cham, Switzerland :  |b Springer,  |c 2017. 
300 |a 1 online resource (xii, 172 pages) :  |b illustrations (some color) 
336 |a text  |b txt  |2 rdacontent 
337 |a počítač  |b c  |2 rdamedia 
338 |a online zdroj  |b cr  |2 rdacarrier 
500 |a Includes index. 
505 0 |a Dedication; Foreword; Foreword; Contents; Chapter 1: Introduction to Radio Frequency and Microwave Microelectronic Packaging; 1.1 Introduction; 1.2 Frequency Bands; 1.3 Distributed Effects; 1.4 Transmission Lines; 1.5 Commonly Used Transmission Lines; 1.6 Dispersion in Transmission Lines; 1.7 Dielectric and Substrate Materials; 1.8 Skin Depth; 1.9 Thermal Conductivity, Electrical Conductivity, and Thermal Expansion; 1.10 Chapter Conclusions; References; Chapter 2: Packaging of Transmit/Receive Modules; 2.1 Introduction to Packaging of Transmit/Receive Modules. 
505 8 |a 2.1.1 Active Electronically Scanned Arrays2.1.2 T/R Module Block Diagram; 2.2 Systems Using T/R Modules; 2.3 T/R Modules in Communication Systems; 2.3.1 Cellular Base Stations; 2.3.2 Wi-Fi Indoor Location Systems Using Phased Arrays; 2.3.3 60 GHz Wi-Fi; 2.3.4 Millimeter-Wave Point-to-Point Systems; 2.4 T/R Modules in Phased Array Radar; 2.4.1 Brick Array; 2.4.2 Tile Array; 2.4.3 Panel Array; 2.5 Thermal Packaging Challenges; 2.6 Wafer Level T/R Module Packaging; 2.7 Conclusions; References; Chapter 3: 3D Transitions and Connections; 3.1 Introduction. 
505 8 |a 3.2 Vertical Transitions Between Planar Transmission Lines3.2.1 Microstrip or Coplanar Waveguide to Stripline; 3.2.2 Top Side Microstrip to Bottom Side Microstrip; 3.2.3 Microstrip to Waveguide Transition; 3.3 Through Silicon Via 3D Transitions; 3.4 Vertical Transitions Using Connectors; 3.5 Vertical Transition Using Flip Chip; 3.6 Conclusions; References; Chapter 4: Electromagnetic Shielding for RF and Microwave Packages; 4.1 Introduction; 4.2 Electromagnetic Radiation; 4.2.1 The Source of Radiation; 4.2.2 How an Antenna Radiates Electric and Magnetic Fields. 
505 8 |a 4.2.3 Theoretical View of Radiation4.2.4 Electromagnetic Simulation and Computational Method; 4.2.4.1 The Finite Element Method; 4.2.4.2 Method of Moments; 4.2.4.3 Finite-Difference Time-Domain; 4.2.4.4 Finite-Differences Frequency-Domain ; 4.3 Shielding Techniques and Methods; 4.3.1 Metal Caps; 4.3.2 Plating; 4.3.3 Spray Coating; 4.3.4 Sputtering; 4.4 Shielding Performance of Thin-layer Conformal Shielding; 4.4.1 Shielding Performance Measurement Methods; 4.4.2 Test Vehicles; 4.4.3 Shielding Effectiveness; 4.4.4 Far-field Shielding Performance Measurements. 
505 8 |a 4.4.5 Near-field Shielding Performance Measurements4.5 Summary; References; Chapter 5: Design of C-Band Interdigital Filter and Compact C-Band Hairpin Bandpass Film Filter on Thin Film Substrate; 5.1 Introduction; 5.2 Microstrip Filter; 5.3 Design of the Interdigital Filter; 5.3.1 Structure of the Filter; 5.3.2 The Simulation Analysis; 5.3.3 The Test Results; 5.4 Design of the Hairpin Filter; 5.4.1 Structure of the Filter; 5.4.2 The Simulation Analysis; 5.4.3 The Test Results; 5.5 Conclusion; References. 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty 
520 |a Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 
504 |a Includes bibliographical references at the end of each chapters and index. 
590 |a SpringerLink  |b Springer Complete eBooks 
650 0 |a Microelectronic packaging. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Kuang, Ken,  |e editor. 
700 1 |a Sturdivant, Rick,  |e editor. 
776 0 8 |i Print version:  |t RF and microwave microelectronics packaging II.  |d Cham, Switzerland : Springer, 2017  |z 3319516965  |z 9783319516967  |w (OCoLC)964648011 
856 4 0 |u https://proxy.k.utb.cz/login?url=https://link.springer.com/10.1007/978-3-319-51697-4  |y Plný text 
992 |c NTK-SpringerENG 
999 |c 99916  |d 99916 
993 |x NEPOSILAT  |y EIZ 

Similar Items