Materials for advanced packaging

This book provides a comprehensive overview of the recent developments in advanced packaging. Established techniques are discussed, as well as emerging technologies, in order to provide readers with the most up-to-date developments.

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Bibliographic Details
Other Authors Lu, Daniel, Wong, C. P.
Format Electronic eBook
LanguageEnglish
Published Cham : Springer, [2016], ©2017.
Edition2nd ed.
Subjects
Packaging > Materials.
elektronické knihy
electronic books
Online AccessFull text
ISBN9783319450988
9783319450971
Physical Description1 online resource (974 pages)

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Summary:This book provides a comprehensive overview of the recent developments in advanced packaging. Established techniques are discussed, as well as emerging technologies, in order to provide readers with the most up-to-date developments.
Item Description:3.5.1.2 Surface-Activated Bonding.
ISBN:9783319450988
9783319450971
Access:Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty
Physical Description:1 online resource (974 pages)

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