Lead-free solders

"Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover: Factors affecting the wetting behavior of solders and evolution of interfacial microstructure ; Pb-free hi...

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Bibliographic Details
Corporate Author ASTM Committee D-2 on Petroleum Products and Lubricants
Other Authors Prabhu, Narayan
Format Electronic eBook
LanguageEnglish
Published West Conshohocken, PA : ASTM International, ©2011.
SeriesJournal of ASTM International. Selected technical papers ; STP 1530.
Subjects
Lead-free electronics manufacturing processes.
Solder and soldering > Materials.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781621987383
9780803175167
Physical Description1 online zdroj (viii, 203 pages) : illustrations.

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Table of Contents:
  • Wetting behavior of solders / G. Kumar, K. Narayan Prabhu
  • A review of Pb-free High-temperature solders for power-semiconductor devices; Bi-base composite solder and Zn-Al-base solders / Y. Takakul, I. Ohnuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, K. Ishida
  • Wetting behavior and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures / S. Narayan, K. Narayan Prabhu
  • Solders joint reliability of SnBi finished TSOPs with Alloy 42 lead-frame under temperature cycling / W. Wang, M. Osterman, D. Das, M. Pecht
  • The microstructural aspect of the ductile-to-brittle transition of tin-based lead-free solders / K. Lambrinou, W. Engelmaier
  • Loading mixity on the interfacial failure mode in lead-free solder joint / F. Gao, J. Jing, F.Z, Liang, R.L. Williams, J. Qu
  • Ball grid array lead-free solder joint strength under monotonic flexural load / P. Geng
  • Tensile properties of Sn-10Sb-5Cu high temperature lead free solder / Q. Zeng, J. Guo, X. Gu, Q. Zhu, X. Liu
  • Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications / S. Mallik, N.N. Ekere, R. Bhatti
  • Rheological characterization and empirical modeling of lead-free solder pastes and isotropic conductive adhesive (ICA) pastes / R. Durairaj, L.W. Man, S. Ramesh.

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