Lead-free solders
"Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover: Factors affecting the wetting behavior of solders and evolution of interfacial microstructure ; Pb-free hi...
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Corporate Author: | |
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Other Authors: | |
Format: | eBook |
Language: | English |
Published: |
West Conshohocken, PA :
ASTM International,
©2011.
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Series: | Journal of ASTM International. Selected technical papers ;
STP 1530. |
Subjects: | |
ISBN: | 9781621987383 9780803175167 |
Physical Description: | 1 online zdroj (viii, 203 pages) : illustrations. |
Summary: | "Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover: Factors affecting the wetting behavior of solders and evolution of interfacial microstructure ; Pb-free high temperature solders for power semiconductor devices ; Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates ; Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling ; Microstructural aspects of the ductile-to-brittle transition ; Loading mixity on the interfacial failure mode in lead-free solder joint ; Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths. ; Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint ; Tensile properties of Sn-10Sb-5Cu high temperature lead free solder ; Empirical modeling and rheological characterization of solder pastes used in electronic assemblies. STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry."--Publisher's website. |
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Item Description: | "Sponsored by ASTM Committee D02 on Petroleum Products and Lubricants"--Page [iii]. |
Bibliography: | Includes bibliographical references. |
ISBN: | 9781621987383 9780803175167 |
Access: | Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity |