Microjoining and nanojoining

Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufactu...

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Bibliographic Details
Corporate Author Institute of Materials, Minerals, and Mining
Other Authors Zhou, Y.
Format Electronic eBook
LanguageEnglish
Published Cambridge, England : Boca Raton : Woodhead Pub. and Maney Pub., on behalf of the Institute of Materials, Minerals & Mining ; CRC Press, 2008.
SeriesWoodhead Publishing in materials.
Subjects
Microelectromechanical systems > Design and construction.
Nanoelectromechanical systems > Design and construction.
Microtechnology.
Nanotechnology.
Joints (Engineering)
Sealing (Technology)
Metal bonding.
Microelectronics.
Nanoelectronics.
elektronické knihy
electronic books
Online AccessFull text
ISBN9781615831845
9781845691790
9781845694043
9781420070835
Physical Description1 online zdroj (xxiv, 810 pages) : illustrations.

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Table of Contents:
  • Introduction
  • Basics of microjoining: Mechanisms of solid-state bonding processes / J.E. Gould. Mechanisms of soldering and brazing / T. Takemoto. Fundamentals of fusion microwelding / G.A. Knorovsky. Modeling of solid state bonding / Y. Takahashi. Modeling of fusion microwelding / B.H. Chang. Sensing, monitoring and control / M. Mayer. Assembly process automation and materials handling / Y.M. Cheung, D. Liu
  • Microjoining and nanojoining processes: Microelectronics wire bonding / I. Lum, M. Mayer, Y. Zhou. Solid-state diffusion bonding / A. Shirzadi. Bonding using nanoparticles / A. Hirose. Diffusion soldering and brazing / M.L. Kuntz, Y. Zhou
  • Laser Soldering / Y.H. Tian, C.Q. Wang
  • Fluxless soldering / J.P. Jung
  • Laser microwelding / I. Mityamoto. Electron beam microwelding / G.A. Knorovsky. Resistance microwelding / S. Fukumoto. Adhesive bonding / S. Bohm, G. Hemken, M. Wagner. Introduction to nanojoining / S. Sahin
  • Microjoining of materials and applications of microjoining: Joining of high temperature superconductors / G. Zou. Joining of shape memory alloys / K. Uenishi, K.F. Kobayashi. Wafer bonding / J. Wei, Z. Sun. Plastics microwelding / I. Jones. Microjoining in medical components and devices / K.J. Ely, Y. Zhou. Hermetic sealing of solid oxide fuel cells / M. Brochu. Joining of bulk nanostructured materials / M. Brochu. Ceramic/metal bonding / A Wu.

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