Lead-free solder interconnect reliability
Saved in:
| Other Authors | |
|---|---|
| Format | eBook |
| Language | English |
| Published |
Materials Park, OH :
ASM International,
2005.
|
| Subjects | |
| Online Access | Full text |
| ISBN | 9781615030934 9780871708168 |
| Physical Description | 1 online zdroj (x, 292 p.) : ill. Available also in a print ed. |
Cover
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| 245 | 0 | 0 | |a Lead-free solder interconnect reliability |h [elektronický zdroj] / |c edited by Dongkai Shangguan. |
| 260 | |a Materials Park, OH : |b ASM International, |c 2005. | ||
| 300 | |a 1 online zdroj (x, 292 p.) : |b ill. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 530 | |a Available also in a print ed. | ||
| 590 | |a Knovel Library |b ACADEMIC - Metals & Metallurgy | ||
| 506 | |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity | ||
| 650 | 0 | |a Microelectronic packaging |x Reliability. | |
| 650 | 0 | |a Solder and soldering. | |
| 650 | 0 | |a Lead-free electronics manufacturing processes. | |
| 655 | 7 | |a elektronické knihy |7 fd186907 |2 czenas | |
| 655 | 9 | |a electronic books |2 eczenas | |
| 700 | 1 | |a Shangguan, Dongkai, |d 1963- | |
| 776 | 0 | 8 | |i Print version: |t Lead-free solder interconnect reliability. |d Materials Park, OH : ASM International, 2005 |z 0871708167 |w (DLC) 2005050106 |w (OCoLC)60543308 |
| 856 | 4 | 0 | |u https://proxy.k.utb.cz/login?url=http://app.knovel.com/hotlink/toc/id:kpLFSIR005/leadfree_solder__interconnect_reliability |
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