Lead-free solder interconnect reliability

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Bibliographic Details
Other Authors: Shangguan, Dongkai, 1963-
Format: eBook
Language: English
Published: Materials Park, OH : ASM International, 2005.
Subjects:
Microelectronic packaging > Reliability.
Solder and soldering.
Lead-free electronics manufacturing processes.
elektronické knihy
electronic books
ISBN: 9781615030934
9780871708168
Physical Description: 1 online zdroj (x, 292 p.) : ill.
Available also in a print ed.

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Table of contents

Description
Bibliography: Includes bibliographical references and index.
ISBN: 9781615030934
9780871708168
Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity

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