Micro-manufacturing engineering and technology

• Other Authors: Qin, Y.
• Format: eBook
• Language: English
• Published: Amsterdam ; Boston : Elsevier, 2010.
• Series: Micro & nano technologies.
• Subjects: Production engineering.; Manufacturing processes.; Microtechnology.; Manufactures.; elektronické knihy; electronic books
• ISBN: 9780080947402; 9780815519805; 9780815515456
• Physical Description: 1 online zdroj (xiv, 414 p.) : ill.
• Access: Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity

This book presents applicable knowledge of technology, equipment and applications, and the core economic issues of micromanufacturing for anyone with a basic understanding of manufacturing, material, or product engineering. It explains micro-engineering issues (design, systems, materials, market and industrial development), technologies, facilities, organization, competitiveness, and innovation with an analysis of future potential. The machining, forming, and joining of miniature / micro-products are all covered in depth, covering: grinding/milling, laser applications, and photo chemical etching; embossing (hot & UV), injection molding and forming (bulk, sheet, hydro, laser); mechanical assembly, laser joining, soldering, and packaging. . Presents case studies, material and design considerations, working principles, process configurations, and information on tools, equipment, parameters and control . Explains the many facets of recently emerging additive / hybrid technologies and systems, incl: photo-electric-forming, liga, surface treatment, and thin film fabrication . Outlines system engineering issues pertaining to handling, metrology, testing, integration & software . Explains widely used micro parts in bio / medical industry, information technology and automotive engineering. . Covers technologies in high demand, such as: micro-mechanical-cutting, lasermachining, micro-forming, micro-EDM, micro-joining, photo-chemical-etching, photo-electro-forming, and micro-packaging.