Microelectronics failure analysis desk reference

Saved in:
Bibliographic Details
Corporate Authors: ASM International., Electronic Device Failure Analysis Society.
Other Authors: Ross, Richard J.
Format: eBook
Language: English
Published: Materials Park, Ohio : ASM International, c2011.
Edition: 6th ed.
Subjects:
Microelectronics > Materials > Testing > Handbooks, manuals, etc.
Microelectronics > Defects > Testing > Handbooks, manuals, etc.
Electronic apparatus and appliances > Testing > Handbooks, manuals, etc.
Electronics > Materials > Testing > Handbooks, manuals, etc.
Electronics > Materials > Defects > Handbooks, manuals, etc.
elektronické knihy
electronic books
ISBN: 9781613447598
9781615037261
9781615037254
Physical Description: 1 online zdroj (xi, 660 p.) : ill.

Cover

Table of contents

LEADER 02793cam a2200481 a 4500
001 79001
003 CZ ZlUTB
005 20240911214729.0
006 m o d
007 cr |n
008 120109s2011 ohua sbf 001 0 eng d
020 |a 9781613447598  |q (ebook) 
020 |a 9781615037261  |q (ebook) 
020 |z 9781615037254 
020 |z 9781615037261  |q (ebook) 
035 |a (OCoLC)771901447  |z (OCoLC)787848225 
040 |a N$T  |b eng  |c N$T  |d VLB  |d E7B  |d N$T  |d GZM  |d COO  |d ZCU  |d DEBSZ  |d B24X7  |d OCLCQ  |d KNOVL  |d YDXCP  |d KNOVL  |d OCLCQ  |d KNOVL 
245 0 0 |a Microelectronics failure analysis  |h [elektronický zdroj] :  |b desk reference /  |c edited by Richard J. Ross ; EDFAS, ASM International. 
246 3 |a Microelectronics failure analysis desk reference 
250 |a 6th ed. 
260 |a Materials Park, Ohio :  |b ASM International,  |c c2011. 
300 |a 1 online zdroj (xi, 660 p.) :  |b ill. 
500 |a "ASM International, 2011, no. 09110Z"--P. 4 of cover. 
500 |a Some online versions lack accompanying media packaged with the printed version. 
504 |a Includes bibliographical references and indexes. 
505 0 |a Section 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information. 
590 |a Knovel Library  |b ACADEMIC - Electronics & Semiconductors 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity 
650 0 |a Microelectronics  |x Materials  |x Testing  |v Handbooks, manuals, etc. 
650 0 |a Microelectronics  |x Defects  |x Testing  |v Handbooks, manuals, etc. 
650 0 |a Electronic apparatus and appliances  |x Testing  |v Handbooks, manuals, etc. 
650 0 |a Electronics  |x Materials  |x Testing  |v Handbooks, manuals, etc. 
650 0 |a Electronics  |x Materials  |x Defects  |v Handbooks, manuals, etc. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Ross, Richard J. 
710 2 |a ASM International. 
710 2 |a Electronic Device Failure Analysis Society. 
776 0 8 |i Print version:  |t Microelectronics failure analysis.  |b 6th ed.  |d Materials Park, Ohio : ASM International, c2011  |z 161503725X  |w (OCoLC)701026679 
856 4 0 |u https://proxy.k.utb.cz/login?url=http://app.knovel.com/hotlink/toc/id:kpMFADRE01/microelectronics_failure_analysis_desk_reference_6th_edition  |y Plný text 
992 |a BK  |c KNOVEL 
999 |c 79001  |d 79001 
993 |x NEPOSILAT  |y EIZ 

Similar Items