Hybrid microcircuit technology handbook materials, processes, design, testing and production
Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis...
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| Main Author | |
|---|---|
| Other Authors | |
| Format | Electronic eBook |
| Language | English |
| Published |
Westwood, N.J. :
Noyes Publicatons,
c1998.
|
| Edition | 2nd ed. |
| Series | Materials science and process technology series.
|
| Subjects | |
| Online Access | Full text |
| ISBN | 9781591242550 9780815514237 9780815519843 9780815517986 9780080946597 |
| Physical Description | 1 online zdroj (xxi, 579 p.) : ill. |
Cover
Table of Contents:
- Introduction
- Substrates
- Thin Film Processes
- Thick Film Processes
- Resistor Trimming
- Parts Selection
- Assembly Processes
- Testing
- Handling and Clean Rooms
- Design Guidelines
- Documentation and Specifications
- Failure Analysis
- Multichip Modules: A New Breed of Hybrid Microcircuits
- References
- Index.