Hybrid microcircuit technology handbook materials, processes, design, testing and production

Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis...

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Bibliographic Details
Main Author Licari, James J., 1930-
Other Authors Enlow, Leonard R.
Format Electronic eBook
LanguageEnglish
Published Westwood, N.J. : Noyes Publicatons, c1998.
Edition2nd ed.
SeriesMaterials science and process technology series.
Subjects
Online AccessFull text
ISBN9781591242550
9780815514237
9780815519843
9780815517986
9780080946597
Physical Description1 online zdroj (xxi, 579 p.) : ill.

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Table of Contents:
  • Introduction
  • Substrates
  • Thin Film Processes
  • Thick Film Processes
  • Resistor Trimming
  • Parts Selection
  • Assembly Processes
  • Testing
  • Handling and Clean Rooms
  • Design Guidelines
  • Documentation and Specifications
  • Failure Analysis
  • Multichip Modules: A New Breed of Hybrid Microcircuits
  • References
  • Index.