Hybrid microcircuit technology handbook materials, processes, design, testing and production

Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis...

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Bibliographic Details
Main Author: Licari, James J., 1930-
Other Authors: Enlow, Leonard R.
Format: eBook
Language: English
Published: Westwood, N.J. : Noyes Publicatons, c1998.
Edition: 2nd ed.
Series: Materials science and process technology series.
Subjects:
Hybrid integrated circuits > Design and construction > Handbooks, manuals, etc.
elektronické knihy
electronic books
ISBN: 9781591242550
9780815514237
9780815519843
9780815517986
9780080946597
Physical Description: 1 online zdroj (xxi, 579 p.) : ill.

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Table of contents

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100 1 |a Licari, James J.,  |d 1930- 
245 1 0 |a Hybrid microcircuit technology handbook  |h [elektronický zdroj] :  |b materials, processes, design, testing and production /  |c by James J. Licari and Leonard R. Enlow. 
250 |a 2nd ed. 
260 |a Westwood, N.J. :  |b Noyes Publicatons,  |c c1998. 
300 |a 1 online zdroj (xxi, 579 p.) :  |b ill. 
336 |a text  |b txt  |2 rdacontent 
337 |a počítač  |b c  |2 rdamedia 
338 |a online zdroj  |b cr  |2 rdacarrier 
490 1 |a Materials science and process technology series 
520 |a Integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines is also present. 
504 |a Includes bibliographical references and index. 
505 0 |a Introduction -- Substrates -- Thin Film Processes -- Thick Film Processes -- Resistor Trimming -- Parts Selection -- Assembly Processes -- Testing -- Handling and Clean Rooms -- Design Guidelines -- Documentation and Specifications -- Failure Analysis -- Multichip Modules: A New Breed of Hybrid Microcircuits -- References -- Index. 
590 |a Knovel Library  |b ACADEMIC - Electronics & Semiconductors 
506 |a Plný text je dostupný pouze z IP adres počítačů Univerzity Tomáše Bati ve Zlíně nebo vzdáleným přístupem pro zaměstnance a studenty univerzity 
650 0 |a Hybrid integrated circuits  |x Design and construction  |v Handbooks, manuals, etc. 
655 7 |a elektronické knihy  |7 fd186907  |2 czenas 
655 9 |a electronic books  |2 eczenas 
700 1 |a Enlow, Leonard R. 
776 0 8 |i Print version:  |a Licari, James J., 1930-  |t Hybrid microcircuit technology handbook.  |b 2nd ed.  |d Westwood, N.J. : Noyes Publicatons, c1998  |z 0815514239  |w (DLC) 98006322  |w (OCoLC)38573122 
830 0 |a Materials science and process technology series. 
856 4 0 |u https://proxy.k.utb.cz/login?url=http://app.knovel.com/hotlink/toc/id:kpHMTHE001/hybrid_microcircuit_technology_handbook_2nd_edition  |y Plný text 
992 |a BK  |c KNOVEL 
999 |c 78827  |d 78827 

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