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Franke, Jörg (Prof. Dr.-Ing.)
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Three-dimensional molded interconnect devices (3D-MID) : materials, Manufacturing, assembly, and applications for injection molded circuit carriers
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Franke, Jörg (Prof. Dr.-Ing
.)
Year of Publication
2014
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Related Subjects
Design and construction
Injection molding of plastics
Interconnects (Integrated circuit technology)
